Redpine Signals today announced the automobile industry’s most integrated, multi-protocol wireless solution with ultra- low power and a low cost designed to drive the emergence of the connected car. Redpine’s new WaveCombo™solution enables dedicated short-range communications (DSRC) as well as non-DSRC applications while also featuring low power consumption ideal for use in bicycles, helmets, smart phones, and any such non-vehicular applications for rider as well as pedestrian safety.
“The technology providers in the connected car market are quite fragmented with different parts of the solution coming from different vendors, leaving OEMs with incomplete, costly and ineffective wireless solutions,” said Venkat Mattela, CEO of Redpine Signals. “To solve this problem, Redpine leveraged its decades of expertise in multi-protocol wireless communications and low-power designs to develop WaveCombo. Based on customer feedback, this new solution represents the most significant wireless development for the connected car market and we look forward to driving rapid adoption of this technology throughout the automotive industry.”
- Industry’s first V2Xsolution with Integrated 802.11p, 802.11n, Bluetooth and 802.15.4 for V2V, V2I and Intra-Vehicle applications
- Replaces solutions from multiple vendors with a solution that includes chipset, module, IEEE 1609 stack, On-Board Unit (OBU) and Road Side Unit (RSU)
- Significantly reduces the integration time and total cost of development for the car OEMs; enabling the connected car to finally become a reality
- Ultra-low power solution ideal for non-vehicular applications such as bicycles, helmets and smart phones for rider and pedestrian safety
- Upward compatible with upcoming patented simultaneous- dual band solutions for V2X market protecting investment in application development
WaveCombo’s unique wireless technology integration enables several applications and usage model such as emergency vehicle approaching warning (using 802.11p and BT), roadside alert (using 802.11p and BT), smart cone for worker safety (using 802.11p and 802.15.4) and passenger hot spot (802.11p in motion and 802.11n when parked) without the need for adding additional wireless modules. WaveCombo is a compact module (20mm x 23.9mm) and enables form-factor constrained applications.
“V2X communication is an evolving market which needs a close partnership between the 802.11p technology providers such as Redpine Signals and car OEM solution providers like Mitsumi. We are happy to be a partner of Redpine and have been working closely with them to integrate their solution. Their unique wireless combination coupled with higher performance and lower power is ideal for the applications driving the adoption of 802.11p in the market,” said Joe Pullin, Vice President of Global Marketing at Mitsumi Electronics Corp.
“It is an exciting time for the automotive industry. The convergence of two major industries —automotive and high-tech — will result in dramatic changes and disruptions of the current players in and vendors to the automotive industry,” said Kluas Rinnen and James F. Hines of Gartner. Gartner predicts that “by 2020, 80% of all new vehicle models in mature markets will have built-in data connectivity.”
Gartner “Update: Gartner to Initiate SemiconductorCoverage for Connected-Car Electronics” Klaus Rinnen et al, 17 May 2016
WaveCombo Technical Details:
Redpine’s WaveCombo solution includes chipset, modules, IEEE 1609 software stack, stand-alone OBU, OBDII based OBU as well as an RSU. It can operate either in 802.11p mode or 802.11n/Bluetooth/802.15.4 mode. The module provides an output power of +23 dBm with Class C mask at 64 QAM. It also supports an extended temperature range of -40C to +105C critical for several applications. WaveCombo supports 5 MHz, 10 MHz and 20 MHz operations. It has < 1ms switching time between control and service channels with a single module. Redpine provides OBU and RSU for field trials and enables tier-1 suppliers to create infrastructure products based on Redpine technology.
WaveCombo solution also includes a software development kit (SDK) that includes two hardware boards for end to end testing with OBU and RSU reference designs. It embeds IEEE 1609 stack and SAE J2735 messaging along with all the necessary APIs for developing the applications. A few sample applications such as Emergency Electronic Brake Light (EEBL) have also been provided to assist in the development activity.
Redpine will be demonstrating the WaveCombo solution at Booth C191, TU Automotive Detroit, Nuvo, Michigan on June 8 and June 9. Please click here to meet see a demonstration and meet Redpine’s connected car experts.
The WaveCombo chipset, module and IEEE 1609 stack are available now. OBU and RSU solution will be available by Sep 2016. For more information, please visit www.redpinesignals.com.
About Redpine Signals, Inc.
Headquartered in San Jose, California, Redpine Signals, Inc., is a fabless semiconductor, IoT devices and wireless system solutions company focusing on innovative, ultra-low power and high-performance products for next-generation wireless applications. Redpine was founded in 2001 and was the first in the industry to launch an ultra low power and low-cost single-stream 802.11n chipset in late 2007. Again, in 2009 Redpine pioneered the adoption of self-contained 802.11abgn modules into the then emerging IoT market. In 2013, Redpine introduced the world’s first multiprotocol wireless chipset for the Internet of Things market – featuring dual band Wi-Fi, dual-mode BT 4.1, and ZigBee. Redpine has created multiple products based on this chipset including n-Link (hosted), Connect-io-n(embedded), WiSeConnect (advanced embedded secure) and WiSeMCU (MCU and multi-protocol wireless) modules. In 2015, Redpine introduced the award-winning WyzBee IoT platform. Redpine offers technology and products covering multiple market segments in the IoT (industrial, medical, automotive, connected home, connected car, smart energy, building automation and real-time locationing), mobile and networking markets. Redpine’s technology and product portfolio includes chipsets, modules and devices. The company has 220 employees worldwide.