Qualcomm Unveils New Smart Home Reference Platform, Forms JV With TDK To Offer RF Front End Solutions


Qualcomm announced a Smart Home Reference Platform inspired by internet of things technology.  It’s based on Qualcomm Snapdragon 212 processor and capable of providing services like voice recognition, computing, camera, display, audio, excellent connectivity and controlling capacity for smart hubs, home control hubs and other multimedia devices without any hassle.


Reports claim that the first look of this platform was revealed by the company at CES 2016 in the form of smart home assistant/hub. The prototype makes room for full hardware design that’s available to OEMs. Some of the features of this Smart Home Reference Platform are-

  • High-quality audio for streaming audio feedback and music,
  • Supports mp3, WMA, AAC, Ogg Vorbis, FLAC, ALAC, AIFF, PCM and WAV,
  • Equipped with Quad-core 1.3 GHz ARM7 CPU, Qualcomm Hexagon DSP and Qualcomm Adreno 304 GPU,
  • Keyword Voice Wakeup
  • Fast connectivity, including 802.11a/b/g/n, Bluetooth Low Energy, Bluetooth 4.1 and NFC,
  • 8 MP camera and 1080p video playback,
  • Full support for major HLOS (high level operating system).

Qualcomm Forms JV With TDK

Qualcomm has decided to form a joint venture with TDK to deliver RF filters and RF front-end (RFFE) modules into systems for mobile devices used in the internet of things, robotics, drones, and various other automotive applications. The joint venture named RF360 Holdings Singapore PTE. Ltd will enhance TDK’s capabilities in packaging, RF filtering and module integration technologies.

As a result of this joint venture, both TDK and Qualcomm will expand their collaboration to focus on wireless charging and sensors. If everything goes fine, both the companies will conclude all the formalities by the first half of 2017. The RF industry is facing a host of challenges as of now, and both these companies will focus on solving these issues in the best way possible. In addition to this, TDK and Qualcomm will also concentrate on various challenges related to batteries, passive components, sensors, wireless charging and MEMs.

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